1 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com lamp EALP05RDGBA0 features ? choice of various viewing angles ? available on tape and reel. ? reliable and robust ? the product itself will remain within rohs complia nt version ? compliance with eu reach ? compliance halogen free. (br <900 ppm, cl<900 ppm , br+cl <1500 ppm) . description ?the series is specially designed for applications requiring higher brightness ?the led lamps are available with different colors, intensities.. applications ? tv set ? monitor ? telephone ? computer
datasheet lamp EALP05RDGBA0 2 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com device selection guide chip materials emitted color resin color ingan blue water clear absolute maximum ratings (ta=25 ) parameter symbol rating unit continuous forward current i f 25 ma peak forward current (duty 1/10 @ 1khz) i fp 100 ma reverse voltage v r 5 v power dissipation p d 90 mw operating temperature t opr -40 ~ +85 storage temperature tstg -40 ~ +100 soldering temperature t sol 260 for 5 sec. electro -optical characteristics (ta=25 ) parameter symbol min. typ. max. unit condition luminous intensity iv 1600 3200 ----- mcd i f =20ma viewing angle 2 1/2 ----- 20 ----- deg i f =20ma peak wavelength p ----- 468 ----- nm i f =20ma dominant wavelength d ----- 470 ----- nm i f =20ma spectrum radiation bandwidth ? ----- 35 ----- nm i f =20ma forward voltage v f 2.7 3.3 3.7 v i f =20ma reverse current i r ----- ----- 50 a v r =5v
datasheet lamp EALP05RDGBA0 3 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com typical electro -optical characteristics curves relative intensity vs. wavelength (ta=25 ) directivity (ta=25 ) relative intensity (a.u.) radiation angle wavelength (nm) relative intensity (a.u.) forward current vs. forward voltage (ta=25 ) relative intensity vs. forward current (ta=25 ) forward current (ma) 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5 10 15 20 25 forward voltage(v) relative intensity(a.u.) 0 5 10 15 20 25 0.0 0.5 1.0 1.5 forward voltage (v) forward current (ma) relative intensity vs. ambient temp. forward curren t vs. ambient temp. relative intensity(a.u.) 25 30 35 40 45 50 55 60 65 70 0.0 0.5 1.0 1.5 2.0 forward current (ma) 0 20 40 60 80 100 0 10 20 30 40 ambient temperature ta () ambient temperature ta ()
datasheet lamp EALP05RDGBA0 4 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com package dimension note: note: 1. all dimensions are in millimeters 2. the height of flange must be less than 1.5mm(0.0 59"). 3. without special declared, the tolerance is 0.25 mm.
datasheet lamp EALP05RDGBA0 5 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com pb el ectr ostatic electr onagnet ic magnetic or radioactive relds anti-static for 750 moisture resistant packing materials label explanation ? cpn: customer?s product number ? p/n: product number ? qty: packing quantity ? cat: ranks of luminous intensity ? hue: ranks of dominant wavelength ? ref: ranks of forward voltage ? lot no: lot number packing specification anti-electrostatic bag inner carton outside carton packing quantity 1. min 200 to 500 pcs/1 bag, 4 bags/1 inner carton 2. 10 inner cartons/1 outside carton
datasheet lamp EALP05RDGBA0 6 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com prehead laminar wave fluxing notes 1. lead forming during lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bu lb. lead forming should be done before soldering. avoid stressing the led package during leads formin g. the stress to the base may damage the led?s chara cteristics or it may break the leds. cut the led leadframes at room temperature. cutting the leadframes at high temperatures may cause fail ure of the leds. when mounting the leds onto a pcb, the pcb holes must b e aligned exactly with the lead position of the led. if the leds are mounted with stress at the leads, it causes det erioration of the epoxy resin and this will degrade the leds. 2. storage the leds should be stored at 30c or less and 70%rh or less after being shipped from everlight americas and the storage life limits are 3 months. if the leds are st ored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture a bsorbent material. please avoid rapid transitions in ambient temperatu re, especially, in high humidity environments where condensation can occur. 3. soldering careful attention should be paid during soldering. when soldering, leave more then 3mm from solder jo int to epoxy bulb, and soldering beyond the base of the tie bar is rec ommended. recommended soldering conditions: hand soldering dip soldering temp. at tip of iron 300 max. (30w max.) preheat temp. 100 max. (60 sec max.) soldering time 3 sec max. bath temp. & time 260 max., 5 sec max distance 3mm min.(from solder joint to epoxy bulb) distance 3mm min. (from solder joint to epoxy bulb) recommended soldering profile avoiding applying any stress to the lead frame whi le the leds are at high temperature particularly wh en soldering. dip and hand soldering should not be done more tha n one time after soldering the leds, the epoxy bulb should be p rotected from mechanical shock or vibration until t he leds return to room temperature.
datasheet lamp EALP05RDGBA0 7 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com a rapid-rate process is not recommended for coolin g the leds down from the peak temperature. although the recommended soldering conditions are s pecified in the above table, dip or handsoldering a t the lowest possible temperature is desirable for the leds. wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. cleaning when necessary, cleaning should occur only with is opropyl alcohol at room temperature for a duration of no more than one minute. dry at room temperature before use. do not clean the leds by the ultrasonic. when it is absolutely necessary, the influence of ultrasonic cleaning on the leds depends on factors such as ultrasonic power and the assembled condition. ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the led 5. heat management heat management of leds must be taken into consider ation during the design stage of led application. th e current should be de-rated appropriately by referring to th e de-rating curve found in each product specificati on. the temperature surrounding the led in the applicat ion should be controlled. please refer to the data s heet de-rating curve. 6. esd (electrostatic discharge) the products are sensitive to static electricity o r surge voltage. esd can damage a die and its reliabi lity. when handling the products, the following measures against electrostatic discharge are strongly recommended: eliminating the charge grounded wrist strap, esd footwear, clothes, and floo rs grounded workstation equipment and tools esd table/shelf mat made of conductive materials proper grounding is required for all devices, equip ment, and machinery used in product assembly. surge protection should be considered when designing of commercial products. if tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discha rge are strongly recommended: dissipating static charge with conductive materials preventing charge generation with moisture neutralizing the charge with ionizers 7. directions for use the leds should be operated with forward bias. the driving circuit must be designed so that the leds are not subjected to forward or reverse voltage while i t is off. if reverse voltage is continuously applie d to the leds, it may cause migration resulting in led damag e. 8. other above specification may be changed without notice. everlight americas will reserve authority on mater ial change for above specification. when using this product, please observe the absolu te maximum ratings and the instructions for using o utlined in these specification sheets. everlight americas a ssumes no responsibility for any damage resulting f rom
datasheet lamp EALP05RDGBA0 8 copyright ? 2010, everlight americas all rights res erved. release date : sep. 05. 2005 . issue no: 1 rev:1 www.everlightamericas.com use of the product which does not comply with the a bsolute maximum ratings and the instructions includ ed in these specification sheets. these specification sheets include materials protec ted under copyright of everlight americas corporati on. please don?t reproduce or cause anyone to reproduce them without everlight americas's consent.
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